Microstructure Evolution in Damascene Interconnects
نویسندگان
چکیده
We have developed a 3-dimensional computer simulation tool to study the characteristics of microstructure evolution in damascene interconnects. This tool is based on the Monte Carlo method, and the characteristics of the microstructure evolution have a significant impact on the interconnect reliability. Our simulation results show that it may not be possible to obtain a bamboo microstructure that minimizes electromigration failure in a damascene trench structure if its aspect ratio is much higher than unity. We also find that the bamboo microstructure can be obtained when the seed texture is random.
منابع مشابه
Inhomogeneous deformation and microstructure evolution of Sn-Ag-based solder interconnects during thermal cycling and shear testing
0026-2714/$ see front matter 2012 Elsevier Ltd. A doi:10.1016/j.microrel.2012.01.009 ⇑ Corresponding author at: Department of Materi Shenzhen Graduate School, Harbin Institute of Tec China. Tel.: +86 755 26033463; fax: +86 755 260334 E-mail address: [email protected] (M.Y. Li). Orientation imaging microscopy was adopted to characterize the microstructural changes in Sn–Agbased solder interconnect...
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